COF implementation service: Supporting film design, procurement, implementation, and reel shipment.
We perform high-precision mass bonding of bare chips to flexible printed circuit boards (FPC). We can provide integrated support from film design and procurement to assembly and reel shipment.
COF implementation allows for bulk bonding even with multiple pins, and connections can be made in a short time. Furthermore, compared to TCP, it is possible to accommodate finer bonding pitches. Additionally, since film bending is possible, flexible placement is achievable. We provide a consistent line setup from dicing to electrical characteristic testing.
- Company：ミスズ工業
- Price：Other
